Study of grain size effect of Cu metallization on interfacial microstructures of solder joints

Research article (Microelectronics Reliability, 2019) · cited 29× · AI/ML
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Study of grain size effect of Cu metallization on interfacial microstructures of solder joints

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Study of grain size effect of Cu metallization on interfacial microstructures of solder joints is a scholarly article[1].

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APA 4ort.xyz Knowledge Graph. (2026). Study of grain size effect of Cu metallization on interfacial microstructures of solder joints. Retrieved May 24, 2026, from https://4ort.xyz/entity/study-of-grain-size-effect-of-cu-metallization-on-interfacial-microstructures-of-solder-joints
MLA “Study of grain size effect of Cu metallization on interfacial microstructures of solder joints.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/study-of-grain-size-effect-of-cu-metallization-on-interfacial-microstructures-of-solder-joints.
BibTeX @misc{4ortxyz_study-of-grain-size-effect-of-cu-metallization-on-interfacial-microstructures-of-solder-joints_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Study of grain size effect of Cu metallization on interfacial microstructures of solder joints}}, year = {2026}, url = {https://4ort.xyz/entity/study-of-grain-size-effect-of-cu-metallization-on-interfacial-microstructures-of-solder-joints}, note = {Accessed: 2026-05-24}}
LLM prompt According to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Study of grain size effect of Cu metallization on interfacial microstructures of solder joints — https://4ort.xyz/entity/study-of-grain-size-effect-of-cu-metallization-on-interfacial-microstructures-of-solder-joints (retrieved 2026-05-24)

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