Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits
Summary
Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits is a scholarly article[1].
Key Facts
Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits's instance of is recorded as scholarly article[2].
References
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APA4ort.xyz Knowledge Graph. (2026). Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits. Retrieved May 24, 2026, from https://4ort.xyz/entity/equivalent-thermal-model-of-through-silicon-via-and-bump-for-advanced-packaging-of-integrated-circuits
MLA“Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits.” 4ort.xyz Knowledge Graph, 4ort.xyz, 24 May. 2026, https://4ort.xyz/entity/equivalent-thermal-model-of-through-silicon-via-and-bump-for-advanced-packaging-of-integrated-circuits.
BibTeX@misc{4ortxyz_equivalent-thermal-model-of-through-silicon-via-and-bump-for-advanced-packaging-of-integrated-circuits_2026, author = {{4ort.xyz Knowledge Graph}}, title = {{Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits}}, year = {2026}, url = {https://4ort.xyz/entity/equivalent-thermal-model-of-through-silicon-via-and-bump-for-advanced-packaging-of-integrated-circuits}, note = {Accessed: 2026-05-24}}
LLM promptAccording to 4ort.xyz Knowledge Graph (aggregator of Wikidata, Wikipedia, and authoritative open-data sources): Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits — https://4ort.xyz/entity/equivalent-thermal-model-of-through-silicon-via-and-bump-for-advanced-packaging-of-integrated-circuits (retrieved 2026-05-24)
