Electronic_Component
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Integrated Circuit Series (178)
Microprocessor (80)
Microcontroller (75)
Chipset (39)
System On A Chip (33)
Integrated Circuit (32)
System On A Chip Model (31)
Electronic Component (29)
Processor (26)
Integrated Graphics Processor (19)
Graphics Processing Unit (16)
Cpu Socket (14)
Embedded Controller (8)
System In Package (8)
Model Series (7)
Microprocessor (80)
Microcontroller (75)
Chipset (39)
System On A Chip (33)
Integrated Circuit (32)
System On A Chip Model (31)
Electronic Component (29)
Processor (26)
Integrated Graphics Processor (19)
Graphics Processing Unit (16)
Cpu Socket (14)
Embedded Controller (8)
System In Package (8)
Model Series (7)
NVIDIA H200
Product
GPU from Nvidia, based on the NVIDIA Hoppe architecture and designed to expand both graphical and co
AMD EPYC Zen
class
Zen family of 64-bit microprocessors for servers and workstations
APL0098
class
Apple SoC in iPhone
Xbox One S APU
Place
main system-on-a-chip of the Xbox One, containing the CPU and GPU
MediaTek MT6572W
class
system-on-a-chip by MediaTek
VFPv2
Product
Floating point coprocessor
AMD Versal
class
Exynos 980
class
Zalman ZM-MIC 1
Place
lavalier microphone
MEAS MS5611
Thing
Barometric Pressure Sensors
MSM5232
class
sound chip by Oki Electric Industry
core complex die
Product
a chiplet component of AMD Zen processors
Nvidia A100 SXM4 80 GB
Product
GPU, graphics processing unit
JTAGulator
Product
Hexagon 682
Product
digital signal processor developed by Qualcomm
MT6630
Product
Snapdragon 210
Place
Low-end family of Qualcomm SoCs released in 2015 targeting mobile devices
NOEL-V
class
Exynos 4412
Place
system-on-a-chip processor for smartphones etc.
AMD Ryzen Threadripper 1900X
Place
central processing unit
MIFARE Classic EV1
Product
Contactless smartcard IC
Broadcom BCM2711
Product
ARM system-on-a-chip by Broadcom released in 2020
Snapdragon 810
Place
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Tensilica Xtensa LX6
class
microprocessor core
Snapdragon S2
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Atmel ATSAMD21G18 MCU
Product
cIOD
Product
a chiplet component of consumer AMD Zen processors
Azul Vega 3
Product
CPU
WRX80
Product
motherboard chipset for socket sWRX8 and AMD Ryzen Threadripper PRO processors
Intel Z390
Product
Chipset from Intel for socket 1151
Jamdac
Product
virtual sound chip for the Hybrix platform
Snapdragon 200
Place
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Snapdragon 720G
class
system on a chip
Helio G99
Product
system on a chip
AMD TRX50
Product
Chipset on motherboards for AMD processors
Snapdragon 410
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Spreadtrum SC7727S
Place
SNMC FDC37N958FR
Product
Embedded controller
MEC1621
Product
SETA ST
Product
Nintendo DSP
Product
digital signal processor for the SNES
IBM Nighthawk
Product
Quantum processor from IBM with “error mitigation”, 5000 gates and 120 qubits
PlayStation 5 APU
Place
main system-on-a-chip of the PlayStation 5, containing the CPU and GPU
IBM Starling
Product
IBM quantum processor planned for 2029 (100 million gates, 200 logical qubits)
AMD Raven
Product
gpu from the GCN 5.0 microarchitecture
Semtech SX1301
Product
3DLabs P20
Product
Successor of the graphics processor 3Dlabs P10
Google Ironwood
Product
Tensor processing unit by Google
CM–15
Place
large-diaphragm condenser microphone by Teenage Engineering
Nvidia Blackwell B200
Product
graphics processing unit
K5-75
Product
cpu of the k5 microarchitecture
DM6 SeisMic
Place
supercardioid condenser microphone
Cortical Processor
Product
hardware implementation of the hierarchical temporal memory