Electronic Component

Hexagon 680

Product

digital signal processor developed by Qualcomm

Intel HD Graphics 4600

Product

Votrax SC-01

Thing

speech synthesis IC

Unicore

Product

Type of toroidal transformer

IBM Telum II

Product

2024 microprocessor for IBM mainframes

Snapdragon 210

Place

Low-end family of Qualcomm SoCs released in 2015 targeting mobile devices

Intel Smart Sound Technology

Product

integrated audio DSP (Digital Signal Processor) built to handle audio, voice, and speech interactions

sIOD

Product

a chiplet component of server and high-end desktop AMD Zen processors

Atmel ATSAMD21G18 MCU

Product

AMD Ryzen Threadripper 1900X

Place

central processing unit

ETHOS

Place

Broadcast condenser microphone by Earthworks Audio

PlayStation 5 APU

Place

main system-on-a-chip of the PlayStation 5, containing the CPU and GPU

AMD Ryzen Threadripper 1920X

Place

central processing unit

Nvidia Blackwell B200

Product

graphics processing unit

DM6 SeisMic

Place

supercardioid condenser microphone

Intel Z390

Product

Chipset from Intel for socket 1151

texture cache

Product

a read only cache from which texture sampling is performed

AMD TRX50

Product

Chipset on motherboards for AMD processors

MEC1633

Product

Embedded controller

Nvidia A100 SXM4 80 GB

Product

GPU, graphics processing unit

X399

Product

motherboard chipset for socket TR4 and AMD Ryzen Threadripper processors

ENE KB9012

Product

Embedded controller

AMD Renoir

Product

gpu from the GCN 5.1 microarchitecture

Tensilica Xtensa LX6

class

microprocessor core

Snapdragon 662

Place

system-on-a-chip developed by Qualcomm

VFPv2

Product

Floating point coprocessor

APL2298

class

Apple SoC in iPod Touch (3rd Generation)

Mediatek Dimensity 6100+

Product

smartphone SoC

Snapdragon S3

class

system-on-a-chip developed by Qualcomm for primary use in mobile phones

Allwinner A64

class

system-on-a-chip model from 2015 with a quad-core ARM Cortex-A53 CPU and Mali-400 MP2 GPU

Google Ironwood

Product

Tensor processing unit by Google

3DLabs P20

Product

Successor of the graphics processor 3Dlabs P10

Ardeno 430

Product

integrated graphics card for (mostly Android based) smartphones and tablets

Xiaomi Xring O1

Place

system-on-a-chip model developed by Xiaomi

Exynos 980

class

IBM Nighthawk

Product

Quantum processor from IBM with “error mitigation”, 5000 gates and 120 qubits

Spreadtrum SC7727S

Place

Jamdac

Product

virtual sound chip for the Hybrix platform

WRX80

Product

motherboard chipset for socket sWRX8 and AMD Ryzen Threadripper PRO processors

Broadcom BCM2711

Product

ARM system-on-a-chip by Broadcom released in 2020

AMD Versal

class

Intel HD Graphics 4400

Product

Intel integrated graphics

KGV-72 Type-1 Programmable Encryption Device

Product

American military encryption device developed by L3Harris

Snapdragon 778G+ 5G

Place

system-on-a-chip for mobile devices

BCM5976TC1KUB60G

Product

Broadcom touch controller

Intel UHD Graphics 615

Product

ENE KB3700

Product

Embedded controller

Goonhilly Antenna No. 2

Product

decommissioned antenna at Goonhilly Satellite Earth Station

MediaTek MT6739

class

system-on-a-chip for smartphones etc.

S-DD1

Product

Nintendo ASIC for SNES cartridges

AMD Rembrandt

Product

gpu from the RDNA 2 microarchitecture

Snapdragon 808

class

system-on-a-chip developed by Qualcomm for primary use in mobile phones

AMD X670

Product

Chipset of AMD processors

ARM Mali-T830

Product

TMS5220

Product

Google Coral USB accelerator

Product

AI inferencing accelerator that uses the Edge TPU coprocessor

Snapdragon 800

Place

BCM5352

class

router system-on-chip (SoC)

APL0278

class

Apple SoC in iPod Touch (2nd Generation) and iPod Nano (4th Generation)

AMD Picasso

Product

gpu from the GCN 5.0 microarchitecture