Electrical Element

Ranked by notability · Page 15

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Integrated Circuit Series (177)
Microprocessor (80)
Microcontroller (74)
Chipset (39)
System On A Chip (33)
Integrated Circuit (32)
System On A Chip Model (31)
Electronic Component (28)
Processor (26)
Cpu Socket (14)
Embedded Controller (8)
Model Series (7)
Floating-Point Unit (6)
Field-Programmable Gate Array (5)
Sound Chip (5)

Snapdragon 480 Plus 5G
class
system-on-a-chip for smartphones developed by Qualcomm
Chombit
Product
virtual 32-bit CPU architecture for the Hybrix platform
Marvell 88F6828
class
Raling MT7620N
Product
Application Processor
Snapdragon S3
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Google Ironwood
Product
Tensor processing unit by Google
MT6630
Product
Azul Vega 1
Product
CPU
IBM Starling
Product
IBM quantum processor planned for 2029 (100 million gates, 200 logical qubits)
Allwinner H3
Product
Allwinner H3 (sun8iw7p1) SOC 4K OTT Box Total Solution
Xiaomi Xring O1
Place
system-on-a-chip model developed by Xiaomi
Intel B760
Product
Intel chipset
Unicore
Product
Type of toroidal transformer
SMSC LPC47N252
Product
Embedded controller
IBM Telum II
Product
2024 microprocessor for IBM mainframes
sIOD
Product
a chiplet component of server and high-end desktop AMD Zen processors
Atheros AR9001U-2NG
Product
Marvell PXA1908
class
low-end ARM64 SoC released in late 2014
MediaTek Dimensity 700
class
5G-capable system-on-a-chip by MediaTek for smartphones
Spreadtrum SC9830
Product
Renesas H8S/2161BV
Product
Azul Vega 3
Product
CPU
Snapdragon 808
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
AMD X670
Product
Chipset of AMD processors
LANDRS Science Drone Hex1
Place
First iteration of the LANDRS Hexacopter Science Drone
Intel Core i7-4770HQ
Product
central processing unit
HI3798C V200
Product
SoC produced by Hisilicon used in 4K TV boxes
Atmel ATSAMD21G18 MCU
Product
TMS5220
Product
IBM Nighthawk
Product
Quantum processor from IBM with “error mitigation”, 5000 gates and 120 qubits
Snapdragon 600
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
Broadcom BCM5801
Product
cryptographic processor
MEC1308
Product
Embedded controller
Spreadtrum SC7727S
Place
Intel AnyWAN GRX350
Product
processor
Semtech SX1301
Product
Atheros AR9344
Product
ETHOS
Place
Broadcast condenser microphone by Earthworks Audio
STM32L151UCY6
Product
ST Microelectronics Ultra-low-power MCU
MEAS MS5611
Thing
Barometric Pressure Sensors
Jamdac
Product
virtual sound chip for the Hybrix platform
Edge TPU
Product
purpose-built ASIC designed to run inference at the edge
Mediatek MT6737
Product
PlayStation 5 APU
Place
main system-on-a-chip of the PlayStation 5, containing the CPU and GPU
MediaTek MT6572W
class
system-on-a-chip by MediaTek
APL0098
class
Apple SoC in iPhone
MSM5232
class
sound chip by Oki Electric Industry
WRX80
Product
motherboard chipset for socket sWRX8 and AMD Ryzen Threadripper PRO processors
NVIDIA GB10 Grace Blackwell Superchip
Product
complex circuit system optimized for AI calculations
Snapdragon 805
class
system-on-a-chip developed by Qualcomm for primary use in mobile phones
MIFARE Classic EV1
Product
Contactless smartcard IC
Broadcom BCM2711
Product
ARM system-on-a-chip by Broadcom released in 2020
Snapdragon 400
Place
Family of systems-on-a-chip developed by Qualcomm in 2013 for primary use in mobile phones and tablets